Canteliver Probe Card
MPI Cantilever Probe Card is widely utilized on gold bump and pad wafer testing for Exhibit driver, logic, and memory device. MPI’s cantilever probes are definitely the corresponding solution to your demands of fine pitch, tiny pad size, large pace, less cleaning, multi-DUT, large pin rely, and ultra-very low leakage requirements. With excellent craftsmanship, modern architecture and demonstrated methodologies based on mechanical and electrical simulation/measurement outcomes, producing MPI the very best cantilever supplier around the world.
FCB Probe Card
The FCB Probe Card is considered the most mature technological innovation of buckling beam probe card. It can be aimed to accomplish the semiconductor ship manufacture time-to-current market (TTM) and value of examination (COT) need. FCB is actually a verified Remedy for many different semiconductor manufacturing tests from early engineering pilot-operates to significant quantity manufacturing (HVM). FCB is prepared for product necessitating large signal integrity probing (SI) and/or ability integrity probing (PI). Apps incorporate reducing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and much more. FCB guarantees the globe’s best All round Value-of-ownership (COO) for many DUT apps.
EVS Probe Card
The EVS Probe Card is definitely an improvement in excess of the conventional buckling beam probe card. Vital characteristics are larger current carrying ability (C.C.C.) and reduce well balanced Speak to force (BCF), together with General MEMS-like features. EVS can easily meet up with the requirement of State-of-the-art wafer probing. Precise alignment and exceptional planarity control tend to be the important components contributing to stable Speak to resistance. With its potential and efficiency, EVS Probe Card is a super choice for State-of-the-art probe playing cards.
Osprey probe card
The Osprey probe card is MPI’s Answer to desire for at any time finer pitch. It's created for lesser Al pad, and is ideal for small pitch software with peripheral and comprehensive array pattern. With precise alignment and far better planarity Regulate, Osprey can reach larger productiveness by multi-DUT style and design. The forming wire (FW) style needle produced with MPI’s very own micro fabrication approach not simply provides superior-high quality functionality and also lets quick needle substitution and shortens maintaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is equipped with MEMS wire (MW) needle which is designed for the demand of low force probing. It also comes Probe Card along with a chance to fulfill significant C.C.C. and substantial pin counts application. The MEMS method guarantees very constant needle traits, and also the special composition style and design allows precise alignment and planarity control.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/